News5050 – Market Report

December 6, 2017

The Report:

“The next-generation memory (NGM) market is expected to grow at a CAGR of 26.54% during forecast period”
According to the new market research report, the NGM market is expected to reach USD 9.68 billion by 2023 from USD 2.35 billion in 2017, at a CAGR of 26.54% between 2017 and 2023. The growth of this market can be attributed to the increasing enterprise storage application; demand for universal memory devices; need for high bandwidth, low power consumption, and highly scalable memory device for technologies such as artificial intelligence (AI), Internet of Things (IoT), and big data. However, the lack of stability under extreme environmental conditions, and issues with storage in niche application and high cost of emerging memories acting as restraints for the NGM market.
“The NGM market for volatile memory is expected to grow at the highest CAGR between 2017 and 2023”
This report covers the following types of next-generation memory technologies volatile memory and nonvolatile memory. Nonvolatile memory held a larger share of the NGM market in 2016. Nonvolatile memories such as ReRAM and STT-MRAM PCM offer better speed and enhanced performance compared to that provided by volatile memory devices, such as DRAM and SRAM, along with the higher storage densities.
“Enterprise storage application held a larger share of NGM market in 2016”
This report segments the market on the basis of application into consumer electronics, enterprise storage, and industrial, among others. Enterprise storage held the largest market share in 2016, owing to increasing need for data storage capabilities in cloud storage and data centers in enterprise storage.
“300 mm wafer holds the largest share of the NGM market”
This market has been segmented on the basis of wafer size into 200 mm, 300 mm, and 450 mm. 300 mm wafer held the largest market share in 2016. Currently, 300 mm wafer holds a larger share of the market than 200 mm wafer as 300 mm wafer can accommodate double dice per wafer as compared to 200 mm wafer and result in 2-4% lower IC cost/cm per year.
“The NGM market in RoW is expected to grow at the highest CAGR between 2017 and 2023”
This report covers the NGM market in the following regions: North America, Europe, APAC, and RoW. The market in RoW is expected to grow at the highest CAGR between 2017 and 2023. RoW consists of South America, the Middle East, and Africa. The NGM market in RoW is increasing owing to the increasing demand for PCs in the region, which offers a growth opportunity for the memory market for consumer electronics devices.
Breakdown of profiles of primary participants:

o By Company Type: Tier 1–55%, Tier 2–25%, and Tier 3–20%
o By Designation: Directors–50%, Managers–20%, Vice Presidents–25%, Others–5%,
o By Region: North America–40%, APAC–15%, Europe–35%, and RoW–10%

The companies profiled in the report are Samsung (South Korea), Toshiba (Japan), Micron (US), Intel (US), Western Digital (US), SK Hynix (South Korea), Fujitsu (Japan), Everspin (US), Adesto (US), Microchip (US), Avalanche (US), Cypress (US), IBM (US), NXP Semiconductor (Netherlands), Open-silicon (US), Rambus (US), Spin Transfer Technologies (US), Texas Instruments (US), Viking (US), and 4DS Memory (Australia). This report also covers the key innovators, namely, Crossbar (US), Nantero (US), Kilopass (US), and Sidense (Canada).
Research Coverage:
NGM are mainly used in the consumer electronics, enterprise storage, automotive and transportation, military and aerospace, industrial, telecommunications, energy and power distribution, healthcare, agricultural, and retail applications. On the basis of wafer size, this market has been segmented into 200 mm, 300 mm, and 450 mm. This report also covers the following types of next-generation memory technologies: volatile memory and nonvolatile memory. The entire market has been segmented on the basis of region into the North America, Europe, APAC, and RoW.

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Report: REP000343906