MUNDELEIN, ILLINOIS, September, 2015 – Rollomatic, a leading machine tool manufacturer based in Le Landeron, Switzerland, is hosting the bi-annual OpenHouse 2015 event in Rollomatic’s North American headquarters in Mundelein, IL, from November 3rd to 5th, 2015.
Rollomatic continues the success and growth of its series of multi-axis tool grinding machines and peel grinding machines by announcing a number of new options and expanded capabilities in CNC tool grinding, blank preparation, micro grinding and peel grinding during this event. OpenHouse 2015 will be similar to previous sessions where typically over 100 end-users from more than 20 US states, Mexico, and Canada attend. Attendees are also provided with travel and hotel vouchers as well as all meals.
OpenHouse 2015 offers a chance for an inside look at Rollomatic and its precision CNC tool grinding machines with an emphasis on knowledge sharing and industry networking. To register, interested attendees may contact Eric Schwarzenbach at 847 281 8550 ext. 275 or at firstname.lastname@example.org before October 23rd to submit a registration form.
VGPro NEW edition software for endmills, inserts, form tools for 5- and 6-axis tool grinders
NCWalker NEW networking and communication software for Rollomatic grinding machines
Strausak NEW U-Grind 5-axis universal tool & cutter grinding machine with Numroto software
Strausak NEW W-Dress, manual wheel dressing machine
LS-Smart II NEW round tool measuring device for fluted tools, variable helix and cylindrical parts
GrindSmart NEW 528XF 6-axis CNC tool grinder for ultra-long drills and cutting tools
LaserSmart Fine laser cutting and ablation machine for PCD, CVD and natural diamond
GrindSmart 528XW & 629XW CNC tool grinders with wheel/nozzle changers
GrindSmart Nano6 & Nano5 ultra-small tool grinders
ShapeSmart NP5 & NP3 peel and pinch grinders
ProfileSmart CNC profile dressing machine for automatic truing of wheel packs
Software presentations of VGPro, NC Walker, and Numroto
Scheduled demos several times per day on each machine
Platit presentation of coating technology
Rollomatic provides outstanding service and superior product support from our North American headquarters located in Mundelein, IL, as well as Rollomatic’s satellite office on the West coast. By providing complete grinding solutions for today’s high quality cutting tool manufacturing for a wide variety of applications, our experienced team of engineers will help you reach new milestones in tool manufacturing by combining precision, flexibility, productivity and reliability in each machine we craft.
For more information, visit us at: www.RollomaticUSA.com or e-mail solutions@RollomaticUSA.com. Interviews or media presentations are available upon request.
North American Headquarters:
1295 Armour Boulevard
Mundelein, IL 60060
London, 24 August 2015: The UK’s leading peacebuilding charity International Alert is delighted to announce that it will be staging a series of peace-inspired hackathons in cities around the world to mark this year’s UN International Day of Peace (Monday 21 September).
The hackathons, known as #peacehacks, will run in Barcelona (Spain), Beirut (Lebanon) and London (England) over two days on the weekend of 26–27 September. Details for #peacehacks in Medellín (Colombia), Colombo (Sri Lanka), Derry (Northern Ireland) and Washington DC (USA) will be confirmed later this month.
Through bringing together technologists, developers, designers and peace practitioners, all #peacehacks will focus on generating innovative solutions for using technology to build peace in cities.
Building on the success of the first ever #peacehack, which took place in London last year, they will each be themed to explore the challenges facing their particular urban context – from violent extremism in London to access to resources in Lebanon.
Dan Marsh, Head of Technology at International Alert, said: “Technology can be used to incite, or even perpetrate violence. But it can also bring people together, make voices heard and improve lives. Our #peacehacks present an exciting platform for exploring these opportunities on a global stage. We expect this movement to generate a number of innovative ideas that will underline the enormous potential of technology to contribute towards peacebuilding efforts around the world.”
The hackathons will take place in some leading technological hubs around the world, including Google Campus London and Berytech Digital Park in Beirut.
They are running as part of International Alert’s Talking Peace Festival – a month-long series of creative events designed to spark conversations about peace through creativity.
Schwerzenbach, Switzerland (July 27, 2015) – METTLER TOLEDO is pleased to introduce two new products to the Thermal Analysis Premium portfolio, the DSC3+ and TGA/DSC 3+, for superior results on the most demanding applications. The DSC3+ features premium furnace and sensor technology, while the TGA/DSC 3+ provides trustworthy results using a high performance METTLER TOLEDO balance that allows users to analyze a wide variety of sample types up to 1600 °C.
Premium Furnace/Sensor Technology
The DSC 3+ features the latest premium furnace technology combined with cutting-edge sensor technology: the FRS 6+ for outstanding resolution and the HSS 9+ for unbeatable sensitivity. This newly developed furnace/sensor combination is the perfect solution for long-term stability and durability in the most demanding application environments. The 6th generation of bottom-bonded, surface stabilized sensors represents more than two decades of innovative technology and provides superior results in industry standard qualification tests. For example, the indium height to width ratio is improved to 19.5 mW/°C and higher than 155 mW/°C when applying data optimization. Taking all this into account, it is quite evident that the METTLER TOLEDO DSC sensors combine a number of characteristics that are unattainable with conventional sensors used in other instruments.
The investigation of very small to very large sample volumes requires variation of heating rates, crucible types and method gas to properly analyze important material parameters or transitions. The unique built-in FlexCal® technology automatically applies the correct calibration parameters to match the specified heating rate, method gas and crucible type, thus eliminating the worry associated with choosing a specific calibration between experiments. This results in faster measurements as the user does not need to repeat calibration measurements for every change of a measurement parameter as is the case with ordinary DSC instruments
The DSC 3+ is operated by the new version 14.0 STARe Thermal Analysis software with the single frequency modulated temperature technique, alternating DSC (ADSC), included and the advanced multi-frequency modulated technique TOPEM® available as an option. These techniques offer programming and evaluation possibilities and are especially useful for the separation of overlapping effects and accurate heat capacity determination. Thanks to the versatile modularity of the DSC system, each instrument can be configured according to the requirements of its intended use. Should requirements change after installation, the instrument can be upgraded as needed. This protects the initial investment. Among these available options is the combination of the DSC with a microscope for visual inspection of thermal effects or the usage of a photo calorimetry accessory to study UV-induced curing reactions.
All this makes the DSC 3+ the first choice for users that need high performance combined with versatile modularity and flexible calibration.
Versatile New Simultaneous Thermal Analyzer
The TGA/DSC 3+ features the latest XP micro- and XPU ultra-microbalances from the world-wide leader in laboratory weighing solutions. In the last two decades, METTLER TOLEDO has proudly provided the only thermogravimetric analyzer on the market that can measure up to 50 million resolution points continuously down to 0.1 µg for a 5 gram sample weight. This delivers a true dynamic range which corresponds to the maximum load of the balance and enables a wider variety of sample types to be measured in regards to mass and density. The internal calibration weights, which are used for a fully automatic motorized self-adjustment, ensure that the balance always delivers accurate and reliable results. Since no user action is required, one can never forget to calibrate the balance. In an important industry standard qualification test, the Minimum Weight determination also takes the environment in which a balance is located into account when describing the instrument performance and deciding on the appropriate starting mass for the sample.
The thermo-balance installed in the TGA/DSC 3+ typically delivers repeatability at least two times better than other thermogravimetric analyzers. The improved thermostating of the balance contributes to excellent weighing performance and precise temperature control, even when positioned adjacent to a furnace operating at very high temperatures. This guarantees reproducible results independent from changing environmental conditions in the workplace. The TGA/DSC 3+ is now available with various TGA, DTA and DSC sensors with optimized balance beams which offer better baseline quality, reliable weighing and simultaneous heat flow results at temperatures from ambient to 1100 °C or 1600 °C. This allows for complete thermal analysis in a single-step process and makes a wider application range possible. Built-in user selectable automatic buoyancy compensation eliminates the need for time-consuming baseline measurements.
Thanks to the versatile modularity of the system, each instrument can be configured according to the requirements of its intended use. Should requirements change after installation, the instrument can be upgraded as needed. This protects the initial investment. Among those options available are various interfaces for hyphenated techniques like MS, FTIR, GC/MS or a sorption accessory. All systems for evolved gas analysis (EGA) can be operated together with the sample robot for the automatic analysis of multiple samples.
For more information on METTLER TOLEDO’s Thermal Analysis Excellence products, visit www.mt.com/ta.
|About METTLER TOLEDO
METTLER TOLEDO is a leading global manufacturer of precision instruments. The company is the world’s largest manufacturer and marketer of weighing instruments for use in laboratory, industrial and food retailing applications. The company also holds top-three market positions in several related analytical instruments markets and is a leading provider of automated chemistry systems used in drug and chemical compound discovery and development. Additional information about METTLER TOLEDO can be found at www.mt.com/lab.Contact:
Natalia Román López
Global LAB Marketing
Direct: +41 44 944 2151
Im Langacher 44
Greifensee 8606 ZH
The Board of Sandvik and Olof Faxander, President and CEO, has agreed that Olof Faxander as of today has left his current position and the company.
Björn Rosengren, currently President and CEO of Wärtsilä Corporation, will succeed Olof Faxander as of 1 November 2015.
Olof Faxander has been the President and CEO of Sandvik since 2011.
“He has managed Sandvik through very challenging market conditions and made creditable contributions in the restructuring of Sandvik to a more efficient organization”, says Johan Molin, Chairman of Sandvik. “The change of President and CEO was initiated by the Board and should be viewed as a next step in Sandvik’s further development”.
Björn Rosengren is 56 years and is currently the President and CEO of Wärtsilä Corporation, since September 2011. Prior to that he held several management positions at Atlas Copco, in total for about 13 years, in addition he has a strong background from other industrial companies (Nordhydraulic, Nordwin AB, ESAB Group).
“I know Björn Rosengren as an exceptionally experienced and successful industrial leader. He has the experience needed to develop Sandvik into the future”, says Johan Molin.
“I look forward to joining Sandvik, a well-recognized industrial company with great potential”, says Björn Rosengren.
Mats Backman, Executive Vice President and CFO, will be acting President and CEO in the interim period until Björn Rosengren starts his new position at Sandvik.
There will be a press conference and conference call for media and analysts tomorrow, 11 August, at 09.00 CET, followed by media interviews, where this change will be commented upon.
Johan Molin, Björn Rosengren and Mats Backman will participate.
Press conference and conference call
Press conference venue: World Trade Center, Stockholm (Kungsbron 1). Room: New York
Dial in details for the conference call:
SE: +46 8 519 99032
In increasingly volatile markets, it is more critical than ever that metal traders are managing their risks in the most effective manner. The Metals Trading Risks 2015 Summit, held by IRN next week on 10th-11th June in Geneva at The Hotel Royal, will fully assess and show latest best practises in market, counterparty, regulatory, financial and supply chain risk affecting trading activity and how to adapt strategies accordingly.
The Summit will bring together metals traders from across the globe – trading houses, financial institutions, suppliers, consumers, alongside consultants, software providers, legal advisers and many others that will provide more information on price risk, hedging strategy, latest developments around regulations affecting trading (including EMIR, MiFID II, the Dodd-Frank Act and FMIA), credit risk and trade finance, or CTRM systems selection and implementation.
The 5th Metals Trading Risks 2015 Summit will analyse all these risks companies involved in metals trading are currently facing. The Summit will begin on the first day with an outlook on how the metals industry has developed over the past year, with focus on the state of European metal trading sector. This Keynote Address will be given by the Head of Commodities Research from Natixis, Nic Brown. The session will be followed by an update from the London Metal Exchange, led by Alex Shaw, Business Development Manager, who will analyse in detail how the Exchange has evolved over recent years.
Amongst the Speakers at this Summit are:
Ivan Nappo, Metals & Enegry Regulations Manager, Cargill
Nic Brown, Head of Commodities Research, Natixis
Salih Erturk, Metal, Hedging and Risk Manager, Nexans
Felipe Margueron, Credit Risk Manager, Vale International SA
Nicolas Jouglard, Head of Hedging Units, Rusal/RTI
Geert Van den Broeck, Director of Risk Management, Aludium
Sara Vernersson, Metal Risk Manager, Boliden Commercial AB
Łukasz Bielak, Market Risk Specialist – Hedging Department, KGHM
Hugues Watin-Augouard, Global Middle Officer – Copper Concentrates, Louis Dreyfus Commodities
Harry Knott, Head of Product Management, Brady
Alex Shaw, Business Development Manager, LME
Matt Wade, Head of Risk, LME Clear
Federico Cepeda, Global Commodities Director, Anheuser-Busch InBev SA/NV
Gianlorenzo Capitelli, Credit Director, Gerald Metals
Justin Roux, Head of Communications, Luvata
The 5th Metals Trading Risks 2015 Summit is sponsored by Brady plc, a provider of software solutions for global commodity trading. This Summit is also supported by the London Metal Exchange, the Geneva Chamber of Commerce, Industry & Services (CCIG) and the Minor Metals Trade Association (MMTA).
More information about this year’s meeting, including speakers and agenda, can be found on the website: www.metalssummit.com
Arlington, VA, May 13, 2015 – The Consumer Electronics Association (CEA)®, the owner and producer of the International CES®, today announced that verified attendance at the 2015 International CES reached a record 176,676 industry professionals with 48,833 coming from outside of the U.S. The 2015 CES also set a number of other records, including more than 3,600 exhibitors, more than 2.23 million net square feet of exhibit space, 6,952 media and analyst attendees, 703,602 mentions of #CES2015 during the show with 7.51 billion total potential Twitter impressions, and 153 countries represented. The independent audit, performed by Veris Consulting, LLC, confirms CES’ status as the world’s gathering place for all who thrive on the business of consumer technologies. The full CES attendance audit summary report will be available online at the end of June.
“We are thrilled to have produced such a phenomenal, record setting International CES,” said Gary Shapiro, CEA president and CEO. “Our event offers a one of a kind, ‘can’t miss’ experience that allows our global attendees to see how different technologies from a range of industries impact each other. The International CES remains the single best place to experience the products, services and trends that will be driving the global industry in the months and years to come.”
As CES and the consumer technology industry continue to grow, CEA is establishing procedures to cap attendance at the 2016 International CES at 176,000, or close to a level comparable to the 2015 CES, in an effort to ensure that attendees continue to have a quality experience.
“With the growth of the consumer technology industry and the parallel growth of the International CES comes an increase in the qualified registrant base for our show. While these individuals are qualified industry professionals, we are reaching space capacity and simply can’t accommodate every qualified individual to our show,” said Karen Chupka, CEA senior vice president, International CES and corporate business strategy. “We take seriously our efforts to make sure CES attendees have a positive experience. Enhanced credentialing procedures will enable us to ensure that qualified attendees can participate in our show and conduct business while providing a high-quality experience for all. These efforts also will allow us to improve some of the logistical and operational challenges that come with producing and attending such a large event.”
The new procedures that CEA will enact for the 2016 CES include:
New registrants or previous registrants who did not attend the 2014 or 2015 CES will be subject to new enhanced credentialing and tighter qualification criteria. This means that although individuals may have qualified for registration in previous years, they must resubmit credentials to qualify for the 2016 CES.
To qualify, all registrants must provide a brief description of their industry affiliation along with links to their company website with an employee roster, a description of their business engagement at CES or a link to a current publication or article the registrant authored or in which they were quoted or cited as an industry professional. Alternately, registrants may also provide a business card, health insurance card or other proof of employment verification. In addition, in order to expedite affiliated registrants through the verification process, CES will ask registrants to include a business email address. Additional details can be found at http://www2.ce.org/e/26962/Register-Plan-Register-Now/43nchn/404615055 once registration opens later this year.
Those who attended one of the past two shows will be allowed to register without providing additional industry qualifications, given their loyalty to CES.
CES remains a trade-only event and is not open to the general public.
A new registration fee structure:
CEA is implementing a $100 advanced fee for all registrants beginning July 8 when registration launches.
CEA is providing our loyal alumni who attended the 2014 or 2015 CES with a 30-day window of complimentary registration before the $100 fee goes into effect for this audience.
Registration for qualified media will remain free of charge.
Registration fees will increase to $300 beginning December 21 through the 2016 CES. This move is to encourage more registrants to sign up prior to December 21 to allow CEA ample time to verify credentials for those who register after that date.
“Our new procedures will help us cap the overall growth in CES attendance, promoting a quality business experience for our guests while focusing show and consumer technology industry growth in key areas, including new markets and trends,” stated Chupka.
“The average CES attendee has 33 business meetings at our event so it’s crucial that we make the networking and dealmaking opportunities as easy as possible for our guests,” said Shapiro. “CES is the world’s leading annual innovation event and is setting records across every major category including international attendance. We must always innovate to ensure that CES remains the must-attend event for any professional connected to innovation. These new procedures will help us meet this goal.”
Through these new policies and procedures, CEA is aiming to cap 2016 CES attendance at 176,000.
“We believe this number strikes the balance we seek between producing a show that truly reflects the size and scope of the global consumer technology industry while helping our participants have a positive, quality business experience,” said Chupka. “We won’t, however, turn qualified attendees away at the door! We will refine our new processes as necessary during registration in an effort to stay within our target attendance.”
Veris is certified by the Exhibition and Event Industry Audit Commission (EEIAC) to perform audits. The CES audit provides absolute verification of exhibition records, including direct on-site observation, examination of registration systems and testing of attendee records. Post-show analysis included direct confirmation sampling, reconciliation of attendance lists, elimination of duplicate names, and verification of demographic data with the source of documentation. This audit complies with the industry standards for audits adopted by both the EEIAC and the International Association of Exhibition and Events (IAEE). An independent audit is required to be certified by UFI, the Global Association of the Exhibition Industry, and the International CES is believed to be the only UFI approved event in its category.
Registration for the 2016 CES will open on July 8. More details on 2016 CES policies and procedures can be found at CESweb.org.
Note to Editors: The official name of the global technology event is “International CES®.” Subsequent references to the event can be shortened to “CES.”
The International CES is the world’s gathering place for all who thrive on the business of consumer technologies. It has served as the proving ground for innovators and breakthrough technologies for more than 40 years—the global stage where next-generation innovations are introduced to the marketplace. As the largest hands-on event of its kind, CES features all aspects of the industry. And because it is owned and produced by the Consumer Electronics Association (CEA), the technology trade association representing the $286 billion U.S. consumer electronics industry, it attracts the world’s business leaders and pioneering thinkers to a forum where the industry’s most relevant issues are addressed. Follow CES online at www.CESweb.org and through social media:
UPCOMING EVENTS2015 International CES Asia
May 25-27, 2015, Shanghai, China
May 25-27, 2015, Shanghai, China
November 8-10, 2015, New York, NY
CE Hall of Fame Dinner
November 9, 2015, New York, NY
CES Unveiled New York
November 10, 2015, New York, NY
CES Unveiled Las Vegas
January 4, 2016, Las Vegas, NV
2016 International CES
January 6-9, 2016, Las Vegas, NV